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Epoxy Resin with Mold Release Agent for Electrical Insulation

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Epoxy Resin with Mold Release Agent for Electrical Insulation

Place of Origin : Shanghai, China

Brand Name : WENYOU

Model Number : LD605

MOQ : 1

Price : $3.40-3.60

CAS No. : 1675-54-3

Molecular Formula : C21H24O4

EINECS No. : 216-823-5

Main Raw Material : EPOXY

Composition : Two component resin system

Appearance : Transparent liquid

Packing Size : 20kg/pail or 220kg/drum or 1200kg/tank

Curing Method : Air fast curing

Adhesion Property : Good adhesion to surface

Release Method : Spraying, scraping, dipping

Mold Cleanliness : Reduces dirt accumulation

Defect Reduction : Reduces defective rate

Multiple Demolding : Multiple demolding cycles

Surface Preparation : Requires mold drying

Product Appearance : Improves product appearance

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Product Description
Epoxy Resin with Mold Release Agent for Electrical Insulation
Epoxy Resin with Mold Release Agent for Electrical Insulation
Epoxy Resin with Mold Release Agent for Electrical Insulation
LD605 is mainly used as a release agent for epoxy resin products, especially for difficult-to-release, complex mold insulating parts, transformers, high-voltage switches, dry-type transformers, and other epoxy carbon fiber products.


Epoxy Resin with Mold Release Agent for Electrical Insulation

Important performance:
1. Clean, colorless, oil-free, and good adhesion to the surface
2. Easy to operate
3. Will not transfer to
molded products and can improve the appearance of products
4. Air fast curing
5. Keep the mold clean for a long time to reduce the
defective rate
6. It is once again applied to multiple demolding cycles
7. Reduce the accumulation of dirt and mold surface
Specification
How to use release agent:
In order to obtain the best release effect, the surface of the mold should be dried by the cleaning agent first, and all the previously used trace release agents are cleaned, and the usual brushing methods can be used, such as spraying, scraping, dipping, and spraying. better. When the solvent is completely evaporated, it can be directly produced.

Epoxy Resin with Mold Release Agent for Electrical Insulation
How to use release agent:
In order to obtain the best release effect, the surface of the mold should be dried by the cleaning agent first, and all the
previously used trace release agents are cleaned, and the usual brushing methods can be used, such as spraying, scraping, dipping,
and spraying. better. When the solvent is completely evaporated, it can be directly produced.
Packing & Delivery
Epoxy Resin with Mold Release Agent for Electrical Insulation
Epoxy Resin with Mold Release Agent for Electrical Insulation
Company Profile
Epoxy Resin with Mold Release Agent for Electrical Insulation

Product Tags:

electrical epoxy resin with mold release

      

epoxy resin for electrical insulation

      

insulating epoxy resin with release agent

      
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